Beilstein Arch. 2026, 20261. https://doi.org/10.3762/bxiv.2026.1.v1
Published 06 Jan 2026
In this study, the elastic properties of Cu and (CuxNi1-x)3Sn are calculated to reveal the effects of Ni alloying on the interfacial mechanical properties of (CuxNi1-x)3Sn/Cu in lead-free solder joints. The results reveal that, within the thermodynamically stable domain of (CuxNi1-x)3Sn, the increase of Ni content can enhance the interfacial mechanical properties of (CuxNi1-x)3Sn/Cu, and increase the reliability of the lead-free solder joints. The enhancement mechanism can be attributed the improvements of orientated Young's modulus and ductility of (CuxNi1-x)3Sn achieved by Ni alloying. But higher Ni content beyond the thermodynamically stable domain of (CuxNi1-x)3Sn will deteriorate the interfacial mechanical properties by mechanical mechanism or thermodynamical mechanism, and decrease the reliability of the lead-free solder joints. The results presented in this study will not only unveil the effects of Ni alloying on the interfacial properties of lead-free solder joints, but also will provide a guidance for the high-performed lead-free solder design by alloying strategies to meet the requirements for electronic device miniaturization and harsh environmental applications.
Keywords: Lead-free Solder; Elastic Modulus; Ductility; work of adhesion; Interfacial Toughness;
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Hua, G. Beilstein Arch. 2026, 20261. doi:10.3762/bxiv.2026.1.v1
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© 2026 Hua; licensee Beilstein-Institut.
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