Quantitative estimation of nanoparticle-substrate adhesion by atomic force microscopy

Submitting author affiliation:
Department of Materials Science, Montanuniversität Leoben, Leoben, Austria

Beilstein Arch. 2025, 202546. https://doi.org/10.3762/bxiv.2025.46.v1

Published 08 Jul 2025

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This preprint has not been peer-reviewed. When a peer-reviewed version is available, this information will be updated.

Abstract

Understanding nanoparticle adhesion to substrates is the key for their stability and performance in many applications, including energy systems, nanofabrication, catalysis and electronic devices. In this study, we present a methodology for examining adhesion of copper nanoparticles to silicon substrates deposited under varying conditions using DC magnetron sputter inert gas condensation. Atomic force microscopy was utilized as a tool for the manipulation of the nanoparticles and to measure lateral forces for their displacement, with cantilever calibration achieved through wedge and diamagnetic lateral force calibrator methods. The work of adhesion was quantified by integrating the obtained lateral forces over the distance moved during manipulation, revealing a non-monotonic dependency on nanoparticle size with maximum adhesion observed for particles between 6 and 12 nm. In addition, an applied positive substrate bias voltage led to more energetic landing conditions and thus to increased adhesion forces. This study underscores the suitability of atomic force microscopy in characterizing adhesion on the nanoscale and offers insights into future strategies for tailoring nanoparticle/substrate interactions.

Keywords: magnetron sputtering; nanoparticles; atomic force microscopy; nanomanipulation; adhesion

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When a peer-reviewed version of this preprint is available, this information will be updated in the information box above. If no peer-reviewed version is available, please cite this preprint using the following information:

Çiçek, A.; Kratzer, M.; Teichert, C.; Mitterer, C. Beilstein Arch. 2025, 202546. doi:10.3762/bxiv.2025.46.v1

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